Shin Sung Precision Co., Ltd.

Lead Frame for IC

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Shin Sung Precision Co., Ltd.
[Korea]

Address
75-1 Palgok 2-dong Ansan-si Gyeonggi-do
Phone
82-31-5020087
Contact name
Yongtae Kim

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Product Details

Quick Information

  • Place of Origin: Republic of Korea

Description

  • Lead frames are one of 3 major parts of semiconductor package.

  • The main role of the lead frame is to transfer the electrical signal between PCB board outside and semiconductor chip inside.

  • Major users are the package companies such as Amkor, Chippac & Hynix.


Specifications
  • Material: Cu alloy, A42, SPCC

  • Thickness: 0.1 ~ 0.4 mm

  • Tolerance: ± 0.025 mm

  • Product function: base metal for semiconductor

  • Second operation: Ag, Ni plating, bending press


Product Image

  • Lead Frame for IC image

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